

Tech Specs
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SoC
Qualcomm® QCS6490
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CPU
1× Kryo Prime @ 2.7GHz
3× Kryo Gold @ 2.4GHz
4× Kryo Silver @ 1.9GHz
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GPU
Qualcomm® Adreno 643
– OpenGL® ES 3.2, 2.0, 1.1
– Vulkan® 1.1 / 1.2 / 1.3
– OpenCL™ 2.2
– DirectX Feature Level 12
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AI
Total AI compute performance: 12 TOPS
Hexagon DSP with dual HVX
Hexagon Tensor Accelerator
Hexagon Coprocessor 2.0
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RAM
4GB / 6GB / 8GB / 12GB / 16GB LPDDR5 @ 5500MT/s
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Storage
SPI Flash (bootloader)
eMMC Module: 16 / 32 / 64 GB
UFS Module: 128 / 256 / 512 GB
MicroSD card slot ×1
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Display
HDMI 2.0: up to 4K@30Hz
MIPI DSI: 1× 4-lane
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Camera
MIPI CSI: 1× 4-lane (split to 2× 2-lane)
MIPI CSI: 2× 2-lane
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Wireless
Wi-Fi 6 (802.11 a/b/g/n/ac/ax)
Bluetooth® 5.4 with BLE
Quectel FCU760K Module (AIC8800D80 chipset)
2× external antenna connectors
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Ethernet
1× Gigabit Ethernet with PoE support (via optional HAT)
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USB
1× USB 3.1 Type-A OTG
3x USB 2.0 Type-A HOST
1× USB 2.0 Type-C Power
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Expansion
M.2 M Key: PCIe Gen3 x2 (supports 2230 NVMe SSDs)
Not compatible with SATA
40-pin 2.54mm GPIO header
– UART / I2C / SPI / GPIO / PWM
– 2× 5V in/out, 2× 3.3V out
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Audio
3.5mm audio jack
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Power
12V via USB Type-C or Power input header
Recommended: ≥18W light load, ≥24W full load
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Software
Supports Radxa OS, Ubuntu Linux, Qualcomm Yocto Linux, Armbian, Arch, Deepin, Fedora, Windows
Hardware control libraries available
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Dimensions
85 mm x 56 mm













